Sales@keystonechips.com

+（86） 0755-26910779

EN(UK)

Stringent Quality Control System

At KeyStone Technology, we prioritize providing top-quality electronic components to our clients. We have established two advanced Quality Control Centres in Hong Kong and Shenzhen, spanning 1,000 square meters, and equipped with over 60 sets of inspection equipment and over 50 professional engineers. Our QCS management system covers all inspection processes, from warehousing to electrical testing, ensuring compliance with international standards. Our mission is to never let counterfeit products reach our clients.

Star Quality Inspection Framework

KeyStone maintains a keen focus on fulfilling client’s requirements by delivering high-quality electronic components.

  • Specialization
  • Trackable
  • Assurance
  • Reliability

Specialization

KeyStone has a dedicated team of professionals who are well-versed in industry best practices, regulatory requirements and quality management systems. This is to ensure that all products and services are thoroughly tested and evaluated to identify any potential issues or areas for improvement.

Trackable

Every aspect of our sourcing process, from supplier assessment and quality control to warehousing and transportation, can be easily tracked for each component that we have acquired.

Assurance

Our rigorous testing equipments and skilled engineers provide assurance that the electronic components we procure meet the highest standards and meet our target objectives.

Reliability

Consistency is essential for building trust, which in turn is rooted in reliability. It is crucial for every member of our team to deliver their best consistently as every employee's performance impacts our quality standards.

Smart Quality Inspection Process


KeyStone implements a rigorous 4-tier quality inspection process to ensure that all electronic components meet the highest standards of quality. The first tier involves a visual inspection of the components to check for any physical defects or abnormalities. The second tier includes testing the components to ensure that they meet the required specifications and performance standards. The third tier consist of conducting a comprehensive reliability test to ensure that the components can perform under different conditions and environments. Additionally, KeyStone offers an optional fourth tier, where KeyStone collaborate with a third-party inspection entity to conduct further testing. This multi-tiered approach allows KeyStone to provide high-quality electronic components that are reliable and perform optimally in a range of applications.

Testing Services

To better serve our customers and meet their unique requirements, KeyStone Technology provides ongoing training to our staff and frequently updates our equipment. We take pride in using top-notch testing equipment to ensure that our electronic components meet the highest quality standards.

10 Testing Services we offer:

  • X-Ray Non-Destructive Flaw Inspection

    Conduct real-time non-destructive analysis to inspect the hardware within the component to detect lead frame of the chip, wafer size, gold wire binding diagram, ESD’s holes and damage.

  • Static Parameter Test

    Set the relevant parameters according to the datasheet to ensure the actual value of the passive components is within the acceptable error range.

  • Impedance Analysis Test

    To verify that there is no deviation between the Impedance value and specification difference of Impedance devices.

  • ESD Anti-Static Test

    To verify the surface Impedance co-efficiency, grounding resistance, the instantaneous value and peak value of electrostatic potential of objects such as electrostatic protection materials, device packaging and insulating materials.

  • Solderability Testing

    Check if the tinning ability of the chip pin meets the J-STD-002B standard.

  • High Temperature Aging

    Provides standardised and professional baking and vacuum packaging to avoid moisture damage to the chip, control the temperature of the solder reflow to maintain the usability and reliability of the chip

  • XRF Elemental Measurement and Analysis

    To conduct XRF analysis to ensure the component’s materials are compliant with RoHS regulations.

  • Decapsulation

    Provides decapping service to remove the die completely to check the screen printing, logo information on the wafer, ensuring authenticity of component.

  • SAM Failure Analysis

    Ultrasonic scanning to identify interior materials of electronic component such as delamination, cracks, voids, silicon wafer tilt and foreign contaminants.

  • MCU Programming Test

    Conduct programming testing to ensure components have not been programmed and are in their original factory configuration

Certifications

Our attention on quality is backed by third-party certifications and memberships.